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Lightspring and Morphotonics raised new funding rounds to scale photonic chip and waveguide manufacturing technologies addressing production bottlenecks

Funding Provisional 35% confidence first seen

Tech.eu reports that Lightspring closed a seed funding round to develop 3D-lithography optical interfaces aimed at reducing photonic integrated circuit packaging bottlenecks. It also reports Morphotonics raising more than €40M in a Series B to scale nanoimprint lithography manufacturing technology for waveguides used in AI glasses and other photonic components.

Lightspring Morphotonics Atlantic Concept Ventures Cypris platform EIC Fund Ernij Next European Investment Bank Invest-NL Ixcore OVNI Capital Plug and Play Ventures i-Lab

Source coverage

Lightspring raises €3.5M to tackle photonic chip manufacturing bottleneck Tech.eu independent Morphotonics closes €40M+ Series B to tackle AI devices’ hidden manufacturing bottleneck Tech.eu independent

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